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GL3227E
產品簡述

The GL3227E is an USB 3.1 Gen 1 eMMC RAID reader controller, it provides single LUN (Logic Unit Number) which can support e•MMC v5.0, 1/4/8bit data bus, High Speed SDR/ High Speed DDR/ HS200/ HS400 mode.

 

The GL3227E integrates a high speed 8051 microprocessor and a high efficiency hardware engine for the best data transfer performance between USB and various memory card interfaces. It supports Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB port. It also integrates 5V to 3.3V and 3.3V to 1.8V/1.2V regulators and power MOSFETs which can reduce system BOM cost.


  • USB specification compliance
    • Comply with Universal Serial Bus 3.0 Specification rev. 1.0 (USB 3.1 Gen 1)
    • Comply with Universal Serial Bus Specification rev. 2.0 (USB 2.0)
    • Comply with USB Mass Storage Class Specification rev. 1.0
    • Support USB Mass Storage Class Bulk-Only Transport (BOT)
    • Support 1 device address and up to 3 endpoints: Control (0) / Bulk Data Read In (1) / Bulk Data Write Out (2)
    • Support 5 Gbps SuperSpeed, 480 Mbps high-speed, and 12 Mbps full-speed transfer rates
  • Integrated USB building blocks
    • USB2.0 transceiver macrocell (UTM), Serial Interface Engine (SIE), embedded Power-On Reset (POR)
  • Embedded high speed 8051 micro-controller
  • High efficient DMA hardware engine improves transfer rate between USB and flash card interfaces
  • Support Embedded MultiMediaCard TM (e•MMC)
    • e•MMC specification v4.3/ v4.4/ v4.5/ v5.0
    • High Speed SDR/ High Speed DDR/ HS200/ HS400
  • Support Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB interface
  • Support firmware stored in eMMC and upgrade firmware via USB interface
  • On-Chip 5V to 3.3V, 3.3V to 1.8V/1.2V regulator
  • On-Chip power MOSFETs for flash media cards power source
  • On-Chip 1.8V power source for VCCQ of e•MMC to operate as HS200/HS400 mode.
  • On board 25 MHz Crystal driver circuit
  • Support USB 2.0 LPM (Link Power Management)
  • Support USB 3.1 Gen 1 LTM (Latency Tolerance Messaging)
  • Support USB 3.1 Gen 1 U1/U2/U3 low power link state
  • Pass the USB-IF Test Procedure for SuperSpeed product (TID: 341010008)
  • Support two e•MMC chips by RAID 0 to increase the reading/writing performance
  • Support one or two e•MMC chips by PCB co-layout, flexible for product design
  • Support reset control of e•MMC for better compatibility
  • Support PIA (Partition Information Area) in e•MMC to store customized VID/PID, USB device descriptor, SCSI inquiry and EEP configuration to save extra BOM cost
  • Support programmable SSC (Spread Spectrum Clocking), clock rate in memory card interface for better EMI test effect
  • Support Over-Current protection mechanism
  • Support one power/access indicator LED (shared with SPI_MOSI)
  • Available in QFN48 pin package (6x6mm)

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